Cree Xlamp Led

High-Power R&D Result Sets Record for Solid-State Lighting Industry

"It wasn't long ago when 200 lumens per watt was considered the theoretical maximum efficiency for an LED. We broke that barrier in 2010, and have now achieved 231 lumens per watt," said John Edmond, Cree co-founder and director of advanced optoelectronics. "The innovation from our labs is the foundation for our industry-leading XLamp® LED family and an invention that continues our leadership of the LED lighting revolution.

Solderless Socket Solution for the CREE XLAMP® MP-L™ LED Now ...

HARRISBURG, Pa. -- August 31st, 2010 -- Tyco Electronics (TE), a global leader in engineered electronic components and solutions, releases the solderless LED socket, Type CM, for easy integration of the new Cree XLamp® MP-L™ multichip LED into light fixtures. Introduced as a development program at LIGHTFAIR® International 2010, the product family is now available for production orders.

The new socket offers customers a simple termination solution for the Cree XLamp MP-L LED while allowing ample optical clearance for un-lensed applications. For lensed applications, the socket incorporates a snap-on connect feature for the LEDIL Tyra series of reflectors, which offer directional optics in 18, 30 and 50 degree beam angles.

The solderless LED socket provides a rapid termination solution for the XLamp MP-L LEDs six 0.60mm2 connection pads that are mounted on the top of the LED. This low-profile socket eliminates the need to solder by providing a solderless solution that reduces assembly time while providing a repeatable and separable termination. In addition, the socket is conveniently offered in two versions to suit wire or board applications -- each version is offered with or without attachment features for optics. A third version with an inverted connection option will be available in late September 2010.>

The wire termination version incorporates a TE AMP mini CT connector header that mates to a cable mounted AMP mini CT plug -- allowing for quick, easy wire connections. This version eliminates the need for a circuit board and allows the XLamp MP-L LED to be mounted directly to the heat sink using a thermally conductive adhesive. A six-inch AMP mini CT pigtail assembly is also offered to provide a complete interconnect solution for the XLamp MP-L LED implementation.

The board termination version, suitable for PCB-mount applications, provides a solderless termination directly to the PCB from the XLamp MP-L LED. This version suits applications where drive circuitry and remote connectors are integrated onto the same board as the LED.

The socket design, recognized to UL 1977 requirements (file #E28476), utilizes standard commercially- available hardware for attachment.

Customer drawings, 3D model files and application specifications are available by visiting http://www.te.com/catalog/minf/en/763?BML=10000-L,23305 . To learn more about TEs new solderless LED socket, visit: www.te.com/help or call us at 800-522-6752.

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